Substrate bonding (direct bonding, anodic bonding, vacuum sealing)
Substrate bonding (direct bonding, anodic bonding, vacuum sealing)
This is an introduction to Kenix's "Vacuum Sealing and Bonding Equipment," which manufactures and sells custom-made products. ■□■Features■□■ ■Compatible with anodic bonding, direct bonding, and thermal compression bonding ■Compatible with wafer-level to chip-level bonding ■Heating area and temperature: φ6cm, Max 1,000℃ ■Pressure: Max 1,000kg/cm2 ■Atmospheric pressure: Vacuum to pressurized atmosphere ■Various MEMS sensors, microchips, and next-generation devices ■Surface modification unit can be optionally installed For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.
- Company：ケニックス
- Price：Other
